Surfactant activation bonding device
Surfactant activation bonding device
It can apply a maximum pressure of 1500 kg to an 8-inch wafer and heat it up to a maximum of 1100°C. It is also compatible with ultra-high vacuum.
- 企業：アユミ工業
- 価格：Other
Activated Bonding Device - メーカー・企業と製品の一覧
Activated Bonding Deviceの製品一覧
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Surface active bonding device (room temperature bonding)
Surface active bonding device (room temperature bonding). Bonding at low temperatures without using sealing materials!
●This is an optimal system for the development of next-generation MEMS devices and semiconductor packaging. ●It performs high-precision alignment and weight application in ultra-high vacuum. ●It allows for the bonding of dissimilar materials by directly bonding without heating the substrate. ●It is compatible with load lock systems and cluster systems.
- 企業：アユミ工業
- 価格：Other
![[Comprehensive Catalog] Surface Activation Bonding Device SAB Series](https://image.mono.ipros.com/public/product/image/26f/2000113743/IPROS3080349482417492217.JPG?w=280&h=280)
[Comprehensive Catalog] Surface Activation Bonding Device SAB Series
It can flexibly accommodate changes in sample shape, allowing for various types of bonding experiments, from those that do not use sealing materials to those that can be bonded at room temperature.
We have achieved wafer bonding that provides bulk fracture strength at room temperature. We cater to a range of bonding equipment from research and development to mass production. Our technology is used in a wide variety of fields, including wafer-level packaging and 3D integration. For development purposes, we offer a series of research-grade surface activation bonding devices, ranging from those with focused functions for activation treatment and bonding to those equipped with high-precision alignment and analysis capabilities. For mass production, we provide equipment designed for bonding substrates such as silicon and compound semiconductors after activating the bonding surfaces under ultra-high vacuum conditions. This process allows for bonding at room temperature without the use of sealing materials. For more details, please download the catalog or contact us.
- 企業：アユミ工業
- 価格：Other
Activated Bonding Deviceの関連カテゴリ
- Metal Joining Equipment
- Stir welding equipment
- Ultrasonic bonding equipment
- Anodic Bonding Equipment
- Diffusion Bonding Equipment
- Vibration Bonding Equipment
- Precision Joining Equipment
- Room temperature bonding equipment
- Wafer Bonding Equipment
- Pin joining device
- Automatic Joining Equipment
- Alignment and joining device
- Friction Welding Equipment
- Heat bonding equipment
- Wire splicing device
- Cutting and joining equipment
- Seam Joining Equipment
- Substrate Bonding Equipment
- Equipment Joining Device
- Torsional Joining Device
